Tag: Advanced Packaging

The Bandwidth Dichotomy: An Architectural and Economic Analysis of HBM and GDDR Memory Technologies in the Era of AI

Posted on by uplatzblog

Executive Summary This report provides a comprehensive architectural and economic analysis of the two dominant high-performance memory technologies, High Bandwidth Memory (HBM) and Graphics Double Data Rate (GDDR). It frames Read More …

The Vertical Frontier: An In-Depth Analysis of 3D Stacking, Advanced Interconnects, and the Future of Semiconductor Integration

Posted on by uplatzblog

Introduction: Beyond Planar Scaling The semiconductor industry has, for over half a century, been propelled by the relentless cadence of Moore’s Law, a predictive observation that the number of transistors Read More …