The Photonic Revolution in the Package: An Analysis of Co-Packaged Optics for Next-Generation AI Data Centers

Section 1: Executive Summary The relentless expansion of data generation and processing, catalyzed by the exponential growth of artificial intelligence (AI), machine learning (ML), and hyperscale cloud computing, has pushed Read More …

The Ascendancy of Light: Silicon Photonics as the Foundation for Next-Generation Data Center and Chip-Scale Interconnects

Executive Summary The relentless expansion of data-intensive applications, particularly in artificial intelligence (AI), high-performance computing (HPC), and hyperscale data centers, has pushed traditional electrical interconnects to their fundamental physical limits. Read More …